Mirror Semiconductor Open Air Cavity QFN Package Solutions. Pre moulded substrates. Premolded substrates. Pre-molded air cavity package. Protype IC packaging for MPW Multi-Project wafer MPW. MPC Multi-Project Chip MPC. IC foundry wafer shuttle. Wafer foundry services. Wafer foundries . . . Microelectronic assembly, microelectronic pkg, microelectronic packaging, microelectronic packages, microelectronic package types, microelectronic parts . . . Microelectronics assembly, microelectronics pkg, microelectronics packaging, microelectronics packages, microelectronics package types, microelectronics parts . . . Semiconductor assembly, semiconductor pkg, semiconductor packaging, semiconductor packages , semiconductor parts, semiconductor package types, . . . Semiconductors assembly, semiconductors pkg, semiconductors packaging, semiconductors packages, semiconductors package types, semiconductors parts semiconductor die . . . IC assembly, IC assemblies, IC assembly packaging , IC assembly and test ... Open cavity plastic package , open cavity plastic packages open cavity QFN, open cavity IC package, open cavity IC packages, Open cavity package, Open cavity packages . . . Wire bonding , wire bond, wire bonding in microelectronics , wire bonding wire, wire bonding wedge . . . Wirebonding , wirebond, wirebonding in microelectronics , wirebonding wire, wirebonding wedge . . . Die bonding , Die bond, die bonding process , die bond process, die bonder , die bonder machine . . . Chip Scale package, RF IC design , RFIC design, . . . MEMSic , MEMS , MEMS Package , MEMS Packaging , MEMS IC , MEMSic , MEMS semiconductor , MEMS semiconductors , MEMS foundry , MEMS foundry service , MEMS foundry services, MEMS foundries , MEMS wafer , MEMS wafers , Wafer dicing ,

Description: Air Cavity QFN Package. Organic Open Cavity for MEMS, RF, Sensors and Semiconductors.

Keywords: Mirror Semiconductor, Mirror Semi

Tags: mirrorsemiconductor, package, open, solutions, cavitychip, mirror, semiconductor, cavity, mems, semi, semiconductors, microelectronics, qfn, air, die, assembly, wire, packages, packaging, microelectronic, wafer, bonding, organic, sensors, foundry, wirebonding, parts, types, pkg, bond,

Mirrorsemiconductor.com

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MIRRORSEMICONDUCTOR.COM - Site Location
Country/Flag	United States
City/Region/Zip Code	Los Angeles, California, 90017
Organization	Alchemy Communications
Internet Service Provider	Alchemy Communications