Frontpage
Description: The official website of Pac Tech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping & Packaging Services.
Keywords: WLCSP, wafer bumping, wafer level, backend, semiconductor, packaging, equipment, solder, pac tech, UBM, solder jetting, ball drop, rework, ENIG, ENEPIG, opm, solder balling, microelectronics, flip chip
Tags: pactech, frontpage, pac, tech, wafer, packaging, solder, level, array, key, exists, function, equipment, bumping, ball, rework, tool, apex, technologies, services, usa, automatic, legal, itar, article, read, receive, contact, csp, disclaimer, certification, joins, combined, com, www, manufacturing, advanced, backend, chip, jetting,
Pactech.de
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Content Revalency:
Title: 0.00%
Description: 68.75%
Keywords: 60.87% | Document size: 50,002 bytes
More info: Whois - Trace Route - RBL Check |
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| PACTECH.DE - Site Location | |
| Country/Flag |  Germany |
| City/Region/Zip Code | , , |
| Organization | 1&1 Internet AG |
| Internet Service Provider | 1&1 Internet AG |
| PACTECH.DE - DNS Information | |
| IP Address | 82.165.105.130 ~ Whois - Trace Route - RBL Check |
| Domain Name Servers | ns14.schlund.de 217.160.81.138 ns13.schlund.de 217.160.80.138 |
| Mail Exchange | mx01.schlund.de 217.72.192.67 mx00.schlund.de 212.227.15.41 |
| Site Response Header | |
| Response | HTTP/1.1 200 OK |
| Server | Apache |
| Date | Fri, 15 Apr 2011 12:01:50 GMT |
| Content-Type | text/html; charset=utf-8 |
| Cookie | 41ef2c211bb81add570af1d2a4c0f3c2=f5f2eaf53bfaf46ad1e2fe72c23bd450; path=/ |