Suny Technologies-SemiPac Bank SUNY TECHNOLOGIES CO., LTD (sunypac,Package,Semiconductor package,Chip carrier,high reliability,hermetic,ceramic,metal,QFN,MLP,Plastic QFN,Open Cavity Plastic QFN,Chip Carriers,Ceramic packages,Side Braze,Ceramic Pin Grid Array,Leaded Chip Carriers,Leadless Chip Carriers,Cerdip,Cerquad,SOIC,Ceramic Lids,Lids,Transistor Outline,Dual In Line Package,Flat Pack,Glass Lids,Combo Lids,CPGA,J Bend,Packages,IC Packages,Semiconductor,SSOP, MEMS,LCC,LDCC,DIP Package,PPGA,TSOP,TSSOP,QFP, Hybrid,Cerpac,Plastic SOIC,Headers,Square Lids,Rectangle Lids,TO,Bond Fingers,Open Cavity,Assembly, ,Packaging,Supply Chain,Inventory, Sealing, Excess Materials,Recycle,Encapsulation,Wafer,Die,Spectrum,Technical Ceramic,Die Attach,Leadframe,BGA,Integrated Circuit Packaging,Multichip Module,RF Packages,Small Outline Surface Mount, TO-3, TO-5, TO-8, TO-18, TO-39, TO-46>

Description: sunypac,Package,Semiconductor package,Chip carrier,high reliability,hermetic,ceramic,metal,QFN,MLP,Plastic QFN,Open Cavity Plastic QFN,Chip Carriers,Ceramic packages,Side Braze,Ceramic Pin Grid Array,Leaded Chip Carriers,Leadless Chip Carriers,Cerdip,Cerquad,SOIC,Ceramic Lids,Lids,Transistor Outline,Dual In Line Package,Flat Pack,Glass Lids,Combo Lids,CPGA,J Bend,Packages,IC Packages,Semiconductor,SSOP, MEMS,LCC,LDCC,DIP Package,PPGA,TSOP,TSSOP,QFP, Hybrid,Cerpac,Plastic SOIC,Headers,Square Lids,Rectangle Lids,TO,Bond Fingers,Open Cavity,Assembly, ,Packaging,Supply Chain,Inventory, Sealing, Excess Materials,Recycle,Encapsulation,Wafer,Die,Spectrum,Technical Ceramic,Die Attach,Leadframe,BGA,Integrated Circuit Packaging,Multichip Module,RF Packages,Small Outline Surface Mount, TO-3, TO-5, TO-8, TO-18, TO-39, TO-46

Keywords: sunypac, Package, Semiconductor package, Chip carrier, high reliability, hermetic, ceramic, metal, QFN, MLP, Plastic QFN, Open Cavity Plastic QFN, Chip Carriers, Ceramic packages, Side Braze, Ceramic Pin Grid Array, Leaded Chip Carriers, Leadless Chip Carriers, Cerdip, Cerquad, SOIC, Ceramic Lids, Lids, Transistor Outline, Dual In Line Package, Flat Pack, Glass Lids, Combo Lids, CPGA, J Bend, Packages, IC Packages, Semiconductor, SSOP, MEMS, LCC, LDCC, DIP Package, PPGA, TSOP, TSSOP, QFP, Hybrid, Cerpac, Plastic SOIC, Headers, Square Lids, Rectangle Lids, TO, Bond Fingers, Open Cavity, Assembly, , Packaging, Supply Chain, Inventory, Sealing, Excess Materials, Recycle, Encapsulation, Wafer, Die, Spectrum, Technical Ceramic, Die Attach, Leadframe, BGA, Integrated Circuit Packaging, Multichip Module, RF Packages, Small Outline Surface Mount, TO-3, TO-5, TO-8, TO-18, TO-39, TO-46

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Sunypac.com

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SUNYPAC.COM - Site Location
Country/Flag	China
City/Region/Zip Code	Beijing, Beijing,
Organization	CECT-CHINACOMM COMMUNICATIONS Co.,Ltd.
Internet Service Provider	CECT-CHINACOMM COMMUNICATIONS Co.,Ltd.