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firstlevelinc.com: First Level Inc. - Technology Based Contract Manufacturing Facility First Level Inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services.  

First Level Inc. - Technology Based Contract Manufacturing Facility

Description: First Level Inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services.

 

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First Level Inc.
Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
http://www.firstlevelinc.com/
Top/Business/Electronics_and_Electrical/Components/Semiconductors/Contract_Manufacturing