Process Sciences Incorporated: Homepage

Description: Process Sciences, Incorporated (PSI) is a process engineering resource center and solutions company. We provide outsourcing options that allow our customers to better focus themselves on designing and producing circuit board assemblies. We serve our customers by reworking and repairing valuable assemblies and components, and analyzing and testing for chemical and physical failures on circuit assemblies. We also hold technical training seminars, such as the SMT Bootcamp and the DFx Seminar. Our instructors are senior process engineers, and they often get involved in client issues as consultants.

Keywords: SMT, Surface Mount Technology, Design for Manufacture, Design for Assembly, Design for Test, Electronics Failure Analysis, Materials Qualification, Process Qualification, Solder Joint Evaluation, Solder Joint Analysis, Cleanliness Testing, Ionic Chromotography, Scanning Electron Microscopy, SEM, UV/VIS, Ball Grid Array, Ball Grid Array Rework, BGA, BGA Rework, BGA Reball, CCGA, Column Grid Array, CCGA Rework, Column Grid Array Rework, Process Engineering, Consulting, Process Consulting, Circuit Assembly, Contract Cleaning, Contract Manufacturing, Contamination Analysis, Electronic Assembly Contamination, Electronic Assembly Failure Analysis, Soldering Technology International, Trace Laboratories, Process Sciences, PSI, Process Sciences Incorporated, SIR, Surface Insulation Resistance Testing, IPC, SMTA, IMAPS, Circuit Boards, Circuit Board, Circuit Board Design, Circuitry, Electronic Assembly, Circuit Board Cleaning, Circuit Assembly Cleaning, Circuit Board Rework, Circuit Board Repair, Circuit Assembly rework, Circuit Assembly Repair, Fine Pitch Repair, QFP Repair, Component Refurbishment, Technical Training, Engineering Training, Design Training, Technical Seminars, Design Seminars, Prototype Printed Circuit Boards, Printed Circuit Boards, Printed Circuit Assemblies, Printed Circuit Board Rework, Printed Circuit Board Repair, PCB Rework, PCB Repair, PCB Analysis, PCB Failure Analysis, Cross Sections, X-section, BGA Voids, Ball Grid Array Voids, The Process Circuit