EV Group (EVG) 3D Interconnect - Bonder - Aligner - Coater EV Group (EVG) 3D Interconnect, EVG GEMINI: the only field-proven automated production wafer bonder for 3D integration in the semiconductor industry designed for processing wafer sizes up to 300mm with maximum flexibility. Void-free bonding with sub-micron to micron-level alignment accuracy, Easy conversion to different wafer sizes, Modular design with a minimized footprint; 3d-interconnect.com~Site InfoWhoisTrace RouteRBL Check
